EMIF07-LCD03F3:7-line EMI filter and ESD protection for display interfaces

The EMIF07-LCD03F3 is a 7-line highly integrated L/C filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

The EMIF07-LCD03F3 Flip-Chip packaging means the package size is equal to the die size.

This LC filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up ±15 kV.

Key Features

  • Very thin package: 0.6 mm thickness
  • Lead-free Flip-Chip package in 400 μm pitch
  • Complies with the following standards IEC 61000-4-2 level 4 on inputs and outputs: 15 kV (air discharge) 8 kV (contact discharge)
  • High attenuation in the mobile frequency range (typically better than -40 dB from 900 MHz to 2 GHz)
  • Low line capacitance (30 pF max) suitable for high-speed interfaces
  • Very low clamping voltage
  • Compliant with high speed data rate
  • BenefitsHigh efficiency in EMI filteringHigh bandwidth: typically 200 MHz at -3 dB80% space saving versus discrete solution (BOM reduction)High reliability offered by monolithic integrationHigh reduction of parasitic elements through integration and wafer level packaging
  • Maximum rise and fall time: 6 ns (10% - 90%)
产品规格
DescriptionVersionSize
DS6006: 7-line IPAD™, EMI filter and ESD protection1.2425 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
AN3141: LC filters for mobile phone LCD and camera links1.1338 KB
Technical Notes & Articles
DescriptionVersionSize
TA0318: EMI and ESD consideration for LCD and cameras in wireless handsets1.2115 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF07-LCD03F3Chip Scale Package 0.4mm pitchTape And Reel0.78350NECEAR99-
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF07-LCD03F3Chip Scale Package 0.4mm pitchIndustrialEcopack2
7-line IPAD™, EMI filter and ESD protection EMIF07-LCD03F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
LC filters for mobile phone LCD and camera links EMIF08-LCD04M16
EMI and ESD consideration for LCD and cameras in wireless handsets EMIF08-1005M16
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21