LSM6DS3H:iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.

The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3H is available in a plastic land grid array (LGA) package.

Key Features

  • Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
  • “Always-on” experience with low power consumption for both accelerometer and gyroscope
  • Interface flexibility: selectable SPI (3/4-wire) or I2 C with the main processor
  • Auxiliary SPI (3-wire) to support OIS applications
  • EIS/OIS support
  • Accelerometer ODR up to 6.66 kHz
  • Gyroscope ODR up to 3.33 kHz
  • Smart FIFO
  • ±2/±4/±8/±16 g full scale
  • ±125/±245/±500/±1000/±2000 dps full scale
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IOs supply (1.62 V)
  • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
  • SPI/I2 C serial interface data synchronization feature
  • Embedded temperature sensor
  • ECOPACK® , RoHS and “Green” compliant
产品规格
DescriptionVersionSize
DS11273: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope4.01 MB
应用手册
DescriptionVersionSize
AN4844: LSM6DS3H: always-on 3D accelerometer and 3D gyroscope3.02 MB
Technical Notes & Articles
DescriptionVersionSize
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package5.0218 KB
Design Notes & Tips
DescriptionVersionSize
DT0060: Exploiting the gyroscope to update tilt measure and e-compass1.0226 KB
DT0047: How to install and run the osxMotionAR Activity Recognition library1.1273 KB
DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance1.0616 KB
手册
DescriptionVersionSize
MEMS and Sensors, Smart solutions for IoT and enhanced user experience1 MB
白皮书
DescriptionVersionSize
Optical Image Stabilization (OIS) - white paper1.03 MB
Product Evaluation Tools
型号制造商Description
STEVAL-MKI176V1STLSM6DS3H adapter board for standard DIL24 socket
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
LSM6DS3HVFLGA 2.5X3X0.86 14LTray-1000NECEAR99-
LSM6DS3HTRVFLGA 2.5X3X0.86 14LTape And Reel2.0931000NECEAR99-
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
LSM6DS3HVFLGA 2.5X3X0.86 14LIndustrialEcopack2md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.pdf
md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.xml
LSM6DS3HTRVFLGA 2.5X3X0.86 14LIndustrialEcopack2md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.pdf
md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.xml
iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope LSM6DS3H
LSM6DS3H: always-on 3D accelerometer and 3D gyroscope LSM6DS3H
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
Exploiting the gyroscope to update tilt measure and e-compass LSM303DLHC
How to install and run the osxMotionAR Activity Recognition library X-NUCLEO-IKS01A1
Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance STEVAL-STLKT01V1
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
Surface mounting guidelines for MEMS sensors in an LGA package L3G3200D
md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.pdf LSM6DS3US
md_a037-wspc-vflga-wspc-2.5x3x0.86-wspc-14l_21bbmv7sabb-wspc-(lsm6ds3htr)_a_ver2_signed.xml LSM6DS3US