EMIF02-SPK02F2:2-line IPAD™ EMIF filter and ESD protection

The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.

Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

Key Features

  • Packaged in lead-free Flip Chip
  • Very low resistance: 0.35 Ω
  • High attenuation: -45 dB at 900 MHz
  • Very low PCB space consumption:0.89 mm x 1.26 mm
  • Very thin package: 0.65 mm
  • High efficiency in ESD suppressionIEC6 1000-4-2 level 4
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Complies with the following standards
    • IEC 61000-4-2 level 4:
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)
    • ±8 kV (contact discharge)
Product Specifications
DescriptionVersionSize
DS5928: 2-line IPAD™ EMI filter and ESD protection3.1221 KB
Application Notes
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
HW Model & CAD Libraries
DescriptionVersionSize
EMIF02-SPK02F2 S-parameter model (.sxp)1.0118 KB
Flyers
DescriptionVersionSize
Enhanced ESD protection and EMI filters for audio/video interfaces1.0823 KB
The ultimate HDMI control-link buffer2.1478 KB
Brochures
DescriptionVersionSize
Semiconductor solutions for healthcare applications1.0665 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF02-SPK02F2Chip Scale Package 0.5mm pitchTape And Reel0.3141000NECEAR99CHINA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF02-SPK02F2Chip Scale Package 0.5mm pitchIndustrialEcopack2md_qa-wspc-csps0.5-wspc-4-6_kdqa-wspc-em2t14c_vers2_sdm_signed.pdf
md_qa-wspc-csps0.5-wspc-4-6_kdqa-wspc-em2t14c_vers2_sdm.xml
2-line IPAD™ EMI filter and ESD protection EMIF02-SPK02F2
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-SPK02F2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
STM8L101xx device limitations STM8L101G3
md_qa-wspc-csps0.5-wspc-4-6_kdqa-wspc-em2t14c_vers2_sdm_signed.pdf EMIF02-SPK02F2
md_qa-wspc-csps0.5-wspc-4-6_kdqa-wspc-em2t14c_vers2_sdm.xml EMIF02-SPK02F2