EMIF04-EAR02M8:2-line EMI filter for earphones + 2-line EMI filter for microphones

The EMIF04-EAR02M8 chip is a highly integrated device designed to suppress EMI/RFI noise for mobile phone headsets. The new LC architecture on the speaker lines provides a high attenuation value maintaining a very low serial resistance.

The μQFN-8L package offers the possibility to integrate the whole function in a very small PCB space.

Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.

Key Features

  • lead-free package
  • high attenuation: -30 dB at 900 MHz
  • low cut-off frequencies: 60 MHz for speaker lines
  • high current capability: 50 mA per line
  • very low PCB space consumption: 1.5 mm x 1.7 mm
  • very thin package: 0.6 mm maximum
  • high efficiency in ESD suppression IEC6 1000-4-2 level 4
  • high reliability offered by monolithic integration
  • Complies with following standards:
    • IEC 61000-4-2 level 4 all pins:
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • 8 kV (contact discharge)
Product Specifications
DescriptionVersionSize
DS6161: 4-line IPAD™ EMI filter and ESD protection for headset2.1431 KB
Application Notes
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Flyers
DescriptionVersionSize
Enhanced ESD protection and EMI filters for audio/video interfaces1.0823 KB
The ultimate HDMI control-link buffer2.1478 KB
Sample & Buy
Part NumberPackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF04-EAR02M8uQFN-8LTape And Reel0.5011000NECEAR99MALAYSIA
Quality & Reliability
Part NumberPackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF04-EAR02M8uQFN-8LIndustrialEcopack2md_tv-wspc-dfn.17.15.06-040-8l-e_ectvemi4t9a-wspc-(emif04-ear02m8)-wspc-wcp-wspc-ver2_signed.pdf
md_tv-wspc-dfn.17.15.06-040-8l-e_ectvemi4t9a-wspc-(emif04-ear02m8)-wspc-wcp-wspc-ver2.xml
4-line IPAD™ EMI filter and ESD protection for headset EMIF04-EAR02M8
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF02-MIC06F3
md_tv-wspc-dfn.17.15.06-040-8l-e_ectvemi4t9a-wspc-(emif04-ear02m8)-wspc-wcp-wspc-ver2_signed.pdf EMIF04-EAR02M8
md_tv-wspc-dfn.17.15.06-040-8l-e_ectvemi4t9a-wspc-(emif04-ear02m8)-wspc-wcp-wspc-ver2.xml EMIF04-EAR02M8