SN74LVC1G10 单路 3 输入正与非门

The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

SN74LVC1G10
Pin/Package 5SOT-23, 6DSBGA, 6SC70, 6SOT-23  
Operating Temperature Range(°C) -40 to 85  
IOL(mA) 32  
IOH(mA) -32  
Vcc max(V) 5.5  
Technology Family LVC  
Vcc min(V) 1.65  
Approx. Price (US$) 0.13 | 1ku  
No. of Gates 1  
tpd max(ns) 3.6  
ICC(uA) 10  
Rating Catalog
SN74LVC1G10 特性
SN74LVC1G10 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
74LVC1G10DBVRG4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R (C105, C10R)
74LVC1G125DBVTE4 ACTIVE -40 to 85 0.46 | 1ku SOT-23 (DBV) | 5 250 | SMALL T&R (C105, C10R)
SN74LVC1G10DBVR ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R (C105, C10R)
SN74LVC1G10DBVRE4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R (C105, C10R)
SN74LVC1G10DCKR ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R (C25, C2F, C2R)
SN74LVC1G10DCKRE4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R (C25, C2F, C2R)
SN74LVC1G10DCKRG4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R (C25, C2F, C2R)
SN74LVC1G10YZPR ACTIVE -40 to 85 0.26 | 1ku DSBGA (YFF) | 6 3000 | LARGE T&R (C25, C2F, C2R)
SN74LVC1G10 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
74LVC1G10DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G10DBVRG4 74LVC1G10DBVRG4
74LVC1G125DBVTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVC1G125DBVTE4 74LVC1G125DBVTE4
SN74LVC1G10DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G10DBVR SN74LVC1G10DBVR
SN74LVC1G10DBVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G10DBVRE4 SN74LVC1G10DBVRE4
SN74LVC1G10DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G10DCKR SN74LVC1G10DCKR
SN74LVC1G10DCKRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G10DCKRE4 SN74LVC1G10DCKRE4
SN74LVC1G10DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVC1G10DCKRG4 SN74LVC1G10DCKRG4
SN74LVC1G10YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74LVC1G10YZPR SN74LVC1G10YZPR
SN74LVC1G10 应用技术支持与电子电路设计开发资源下载
  1. SN74LVC1G10 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器门电路产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)