UC2610 双路肖特基二极管阵列

UC2610 描述

This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors. The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time. This single monolithic chip is fabricated in both hermetic CERDIP and copper-leaded plastic packages. The UC1610 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability. The UC2610 in plastic and ceramic is designed for -25°C to 125°C environments also with reduced peak current capability; while the UC3610 in plastic has higher current rating over a 0°C to 70°C temperature range.

UC2610 UC3610
Output Current(A) 1   3  
Vin(V) 0   0  
Vin(Max)(V) 50   50  
Rating Catalog   Catalog
UC2610 特性
UC2610 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
UC2610N ACTIVE -40 to 85 3.30 | 1ku PDIP (P) | 8 50 | TUBE UC2610N
UC2610NG4 ACTIVE -40 to 85 3.30 | 1ku PDIP (P) | 8 50 | TUBE UC2610N
UC2610 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
UC2610N Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type UC2610N UC2610N
UC2610NG4 Pb-Free (RoHS)  CU NIPDAU  N/A for Pkg Type UC2610NG4 UC2610NG4
UC2610 应用技术支持与电子电路设计开发资源下载
  1. UC2610 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器NVSRAM(非易失性 SRAM)产品选型与价格 . xls
  3. PowerPAD™ Thermally Enhanced Package   (PDF  1040 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A)   (PDF  2206 KB)
  5. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  6. PowerPAD™ Made Easy (PDF 57 KB)
  7. 标准线性产品交叉参考 (Rev. D)   (PDF  1058 KB)
  8. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  9. 所选封装材料的热学和电学性质 (PDF 645 KB)
  10. 高速数据转换 (PDF 1967 KB)
UC2610 相关工具
名称 型号 公司 工具/软件类型
UC2610 评估模块 UC2610EVM Texas Instruments 开发电路板/EVM