SN74AUP1T58 单电源电压转换器

AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T58 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply.

The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range.

Schmitt-trigger inputs (VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.

The SN74AUP1T58 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCC or ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed.

Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.

The SN74AUP1T58 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.

NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package

SN74AUP1T58
Voltage Nodes(V) 2.5, 3.3  
Vcc range(V) 2.3 to 3.6  
No. of Bits 3  
No. of Outputs 1  
Bus Drive(ma) -4/4  
Static Current 0.0005  
tpd max(ns) 3.5  
Pin/Package 6DSBGA, 6SC70, 6SON, 6SOT-23  
Technology Family AUP  
Operating Temperature Range(°C) -40 to 85
SN74AUP1T58 特性
SN74AUP1T58 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP1T58DBVR ACTIVE -40 to 85 0.24 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1T58DBVRE4 ACTIVE -40 to 85 0.24 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1T58DBVRG4 ACTIVE -40 to 85 0.24 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1T58DBVT ACTIVE -40 to 85 0.57 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1T58DBVTE4 ACTIVE -40 to 85 0.57 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1T58DBVTG4 ACTIVE -40 to 85 0.57 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1T58DCKR ACTIVE -40 to 85 0.29 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1T58DCKRE4 ACTIVE -40 to 85 0.29 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1T58DCKRG4 ACTIVE -40 to 85 0.29 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1T58DRYR ACTIVE -40 to 85 0.29 | 1ku SON (DRY) | 6 5000 | LARGE T&R  
SN74AUP1T58DSFR ACTIVE -40 to 85 0.29 | 1ku SON (DSF) | 6 5000 | LARGE T&R  
SN74AUP1T58YFPR ACTIVE -40 to 85 0.29 | 1ku DSBGA (YFP) | 6 3000 | LARGE T&R  
SN74AUP1T58YZPR ACTIVE -40 to 85 0.29 | 1ku DSBGA (YZP) | 6 3000 | LARGE T&R  
SN74AUP1T58 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP1T58DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DBVR SN74AUP1T58DBVR
SN74AUP1T58DBVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DBVRE4 SN74AUP1T58DBVRE4
SN74AUP1T58DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DBVRG4 SN74AUP1T58DBVRG4
SN74AUP1T58DBVT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DBVT SN74AUP1T58DBVT
SN74AUP1T58DBVTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DBVTE4 SN74AUP1T58DBVTE4
SN74AUP1T58DBVTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DBVTG4 SN74AUP1T58DBVTG4
SN74AUP1T58DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DCKR SN74AUP1T58DCKR
SN74AUP1T58DCKRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DCKRE4 SN74AUP1T58DCKRE4
SN74AUP1T58DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DCKRG4 SN74AUP1T58DCKRG4
SN74AUP1T58DRYR Green (RoHS & no Sb/Br)  NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DRYR SN74AUP1T58DRYR
SN74AUP1T58DSFR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1T58DSFR SN74AUP1T58DSFR
SN74AUP1T58YFPR Green (RoHS & no Sb/Br)  Call TI  Level-1-260C-UNLIM SN74AUP1T58YFPR SN74AUP1T58YFPR
SN74AUP1T58YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP1T58YZPR SN74AUP1T58YZPR
SN74AUP1T58 应用技术支持与电子电路设计开发资源下载
  1. SN74AUP1T58 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器电压电平转换产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)