The OMAP-L137 C6-Integra™ is a low-power applications processor based on an ARM926EJ-S™ and a C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000™ platform of DSPs.
The OMAP-L137 device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data.
| OMAP-L132 | OMAP-L137 | OMAP-L138 | |
| Applications | Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical | Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical | Communications and Telecom,Consumer Electronics,Energy,Industrial,Medical |
| Operating Systems | DSP/BIOS,Linux,Windows Embedded CE | DSP/BIOS,Linux,Windows Embedded CE | DSP/BIOS,Linux,Windows Embedded CE |
| Typical Power (mW) | 351-1000 | 351-1000 | 351-1000 |
| Standby Power | 36 mW | 63 mW | 36 mW |
| DSP | 1 C674x | 1 C674x | 1 C674x |
| DSP Instruction Type | Floating and Fixed Point | Floating and Fixed Point | Floating and Fixed Point |
| DSP MHz (Max.) | 200 | 456 | 456 |
| DSP Peak MMACS | 1600 | 3648 | 3648 |
| ARM CPU | 1 ARM9 | 1 ARM9 | 1 ARM9 |
| ARM MHz (Max.) | 200 | 456 | 456 |
| ARM MIPS (Max.) | 200 | 456 | 456 |
| TI Audio Codecs | AAC,MP3,WMA,G.711,G.722,G.726 | AAC,MP3,WMA,G.711,G.722,G.726 | AAC,MP3,WMA,G.711,G.722,G.726 |
| On-Chip L1 Cache | 64 KB (DSP) | 64 KB (DSP) | 64 KB (DSP) |
| On-Chip L2 Cache | 256 KB (DSP) | 256 KB (DSP) | 256 KB (DSP) |
| Other On-Chip Memory | 128 KB (Shared RAM) | 128 KB (L3) | 128 KB (L3) |
| Display Options | 1 Output | 1 Output | |
| General Purpose Memory | 1 16-bit (SDRAM, NAND Flash, NOR Flash) | 1 32-bit (SRAM, NAND Flash, NOR Flash) | 1 16-bit (SRAM, NAND Flash, NOR Flash) |
| DRAM | 1 16-bit (LPDDR-300, DDR2-312) | 1 16-bit (LPDDR-300, DDR2-312) | 1 16-bit (LPDDR-300, DDR2-312) |
| USB | 1 | 2 | 2 |
| EMAC | 10/100 | 10/100 | 10/100 |
| SATA | 1 | ||
| MMC/SD | 2 | 1 | 2 |
| UART (SCI) | 3 | 3 | 3 |
| PWM (Ch) | 2 | 3 | 2 |
| eCAP | 3 | 3 | 3 |
| I2C | 2 | 2 | 2 |
| HPI | 1 16-bit | 1 16-bit | |
| uPP | 1 | ||
| McBSP | 2 | 2 | |
| McASP | 1 | 3 | 1 |
| SPI | 2 | 2 | 2 |
| DMA (Ch) | 64-Ch EDMA | 64-Ch EDMA | 64-Ch EDMA |
| Security Enabled | Yes | Yes | |
| IO Supply (V) | 1.8,3.3 | 1.8,3.3 | 1.8,3.3 |
| Operating Temperature Range (C) | -40 to 105,0 to 90 | -40 to 105,-40 to 125,0 to 70,0 to 90,-40 to 90 | -40 to 90,0 to 90,-40 to 105 |
| Pin/Package | 361NFBGA | 256BGA | 361NFBGA |
| Approx. Price (US$) | 9.15 | 1ku | 15.05 | 1ku | 17.10 | 1ku |
| Video Port (Configurable) | 1 Output | 1 Output |
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| OMAPL137BZKB3 | ACTIVE | 0 to 90 | 15.05 | 1ku | BGA (ZKB) | 256 | 90 | |
| OMAPL137BZKB4 | ACTIVE | 0 to 90 | 18.10 | 1ku | BGA (ZKB) | 256 | 1 | |
| OMAPL137BZKBA3 | ACTIVE | -40 to 105 | 18.10 | 1ku | BGA (ZKB) | 256 | 90 | |
| OMAPL137BZKBD4 | ACTIVE | -40 to 90 | 20.35 | 1ku | BGA (ZKB) | 256 | 1 | |
| OMAPL137BZKBT3 | ACTIVE | -40 to 125 | 18.10 | 1ku | BGA (ZKB) | 256 | 90 | |
| XOMAPL137BZKB3 | ACTIVE | 0 to 90 | 18.10 | 1ku | BGA (ZKB) | 256 | 90 |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| OMAPL137BZKB3 | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | OMAPL137BZKB3 | OMAPL137BZKB3 |
| OMAPL137BZKB4 | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | OMAPL137BZKB4 | OMAPL137BZKB4 |
| OMAPL137BZKBA3 | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | OMAPL137BZKBA3 | OMAPL137BZKBA3 |
| OMAPL137BZKBD4 | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | OMAPL137BZKBD4 | OMAPL137BZKBD4 |
| OMAPL137BZKBT3 | Green (RoHS & no Sb/Br) | SNAGCU | Level-3-260C-168 HR | OMAPL137BZKBT3 | OMAPL137BZKBT3 |
| XOMAPL137BZKB3 | TBD | Call TI | Call TI | XOMAPL137BZKB3 | XOMAPL137BZKB3 |
| 培训内容 | 型号 | 软件/工具类型 |
| Code Composer Studio (CCStudio) 集成开发环境 (IDE) v4.x | CCSTUDIO | Code Composer Studio(TM) IDE |
| XDS510 类仿真器 | XDS510 | 仿真器/分析仪 |
| DM6467T SD 子卡 | TMDXSDV6467T | 子卡 |
| TMS320DM6467 引脚 Mux 实用程序 | SPRC815 | 实用程序/插件 |
| 基于 C64x+ 器件的加密（OMAP35x、C645x、C647x、DM646x、DM644x, DM643x、DM674x、DM648） | C64XPLUSCRYPTO | 应用软件 |
| 演示 - DM6467 应用示例和演示代码 | DEMOAPP-DM6467 | 应用软件 |
| 用于 TI DSP+ARM 处理器的 C6EZAccel 软件开发工具 | C6ACCEL-DSPLIBS | 应用软件 |
| 用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER | TELECOMLIB | 应用软件 |
| AM/DM37x 评估模块 | TMDSEVM3730 | 开发电路板/EVM |
| DM6467T 数字视频评估模块 | TMDXEVM6467T | 开发电路板/EVM |
| DM814x/AM387x 评估模块 | TMDXEVM8148 | 开发电路板/EVM |
| DM816x/C6A816x/AM389x 评估模块 | TMDXEVM8168 | 开发电路板/EVM |
| THS8135 评估模块 | THS8135EVM | 开发电路板/EVM |
| TVP5151 评估模块 | TVP5151EVM | 开发电路板/EVM |
| TVP5158 评估模块 | TVP5158EVM | 开发电路板/EVM |
| 编解码器 - 针对 DM6467 器件进行了优化 | DM6467CODECS | 算法/ 解码器 |
| 编解码器 - 音频、视频、语音 - 适用于基于 C64x+ 的器件（OMAP35x、C645x、C647x、DM646、DM644x、DM643x） | C64XPLUSCODECS | 算法/ 解码器 |
| Linux 数字视频软件开发套件 (DVSDK) v2x/v3x - 达芬奇数字媒体处理器 | LINUXDVSDK-DV | 软件开发套件 (SDK) |
