TMS320C6713B-300 浮点数字信号处理器

The TMS320C67x™ DSPs (including the TMS320C6713B device) compose the floating-point DSP generation in the TMS320C6000™ DSP platform. The C6713B device is based on the high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making this DSP an excellent choice for multichannel and multifunction applications.

Operating at 225 MHz, the C6713B delivers up to 1350 million floating-point operations per second (MFLOPS), 1800 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 450 million multiply-accumulate operations per second (MMACS).

Operating at 300 MHz, the C6713B delivers up to 1800 million floating-point operations per second (MFLOPS), 2400 million instructions per second (MIPS), and with dual fixed-/floating-point multipliers up to 600 million multiply-accumulate operations per second (MMACS).

TMS320C6713B-167 TMS320C6713B-200 TMS320C6713B-225 TMS320C6713B-300
CPU 1 C67x     1 C67x     1 C67x     1 C67x    
Peak MMACS 334     400     450     600    
Frequency (MHz) 167     200     225     300    
On-Chip L1/SRAM 8 KB     8 KB     8 KB     8 KB    
On-Chip L2/SRAM 64 KB Cache/192 KB SRAM     64 KB Cache/192 KB SRAM     64 KB Cache/192 KB SRAM     64 KB Cache/192 KB SRAM    
EMIF 1 32-Bit     1 32-Bit     1 32-Bit     1 32-Bit    
External Memory Type Supported Async SRAM,SBSRAM,SDRAM     Async SRAM,SBSRAM,SDRAM     Async SRAM,SBSRAM,SDRAM     Async SRAM,SBSRAM,SDRAM    
DMA (Ch) 16 (EDMA)     16 (EDMA)     16 (EDMA)     16-Ch EDMA    
HPI 1 16-Bit     1 16-Bit     1 16-Bit     1 16-Bit    
McBSP 2     2     2     2    
McASP 2     2     2     2    
I2C 2     2     2     2    
Timers (2) 32-bit     (2) 32-bit     (2) 32-bit     2 32-Bit GP    
Core Supply (Volts) 1.2     1.2/1.26     1.26     1.4 V    
IO Supply (V) 3.3 V     3.3 V     3.3 V     3.3 V    
Operating Temperature Range (°C) -40 to 105     0 to 90,-40 to 105     0 to 90     0 to 90    
Rating Catalog     Catalog     Catalog     Catalog
TMS320C6713B-300 特性
TMS320C6713B-300 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TMS320C6713BGDP225 ACTIVE   23.05 | 1ku BGA (GDP) | 272 40  
TMS320C6713BGDP300 ACTIVE   30.55 | 1ku BGA (GDP) | 272 40  
TMS320C6713BPYP200 ACTIVE   17.60 | 1ku HLQFP (PYP) | 208 36  
TMS320C6713BZDP225 ACTIVE   23.05 | 1ku BGA (GDP) | 272 40  
TMS320C6713BZDP300 ACTIVE   30.55 | 1ku BGA (GDP) | 272 40  
TMS32C6713BGDPA200 ACTIVE   23.50 | 1ku BGA (GDP) | 272 40  
TMS32C6713BPYPA167 ACTIVE   21.85 | 1ku HLQFP (PYP) | 208 36  
TMS32C6713BPYPA200 ACTIVE   20.85 | 1ku HLQFP (PYP) | 208 36  
TMS32C6713BZDPA200 ACTIVE   23.50 | 1ku BGA (GDP) | 272 40  
TMS320C6713B-300 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TMS320C6713BGDP225 TBD   SNPB   Level-3-220C-168 HR TMS320C6713BGDP225 TMS320C6713BGDP225
TMS320C6713BGDP300 TBD   SNPB   Level-3-220C-168 HR TMS320C6713BGDP300 TMS320C6713BGDP300
TMS320C6713BPYP200 Green (RoHS & no Sb/Br)   CU NIPDAU   Level-4-260C-72 HR TMS320C6713BPYP200 TMS320C6713BPYP200
TMS320C6713BZDP225 Pb-Free (RoHS)   SNAGCU   Level-3-260C-168 HR TMS320C6713BZDP225 TMS320C6713BZDP225
TMS320C6713BZDP300 Pb-Free (RoHS)   SNAGCU   Level-3-260C-168 HR TMS320C6713BZDP300 TMS320C6713BZDP300
TMS32C6713BGDPA200 TBD   SNPB   Level-3-220C-168 HR TMS32C6713BGDPA200 TMS32C6713BGDPA200
TMS32C6713BPYPA167 Green (RoHS & no Sb/Br)   CU NIPDAU   Level-4-260C-72 HR TMS32C6713BPYPA167 TMS32C6713BPYPA167
TMS32C6713BPYPA200 Green (RoHS & no Sb/Br)   CU NIPDAU   Level-4-260C-72 HR TMS32C6713BPYPA200 TMS32C6713BPYPA200
TMS32C6713BZDPA200 Pb-Free (RoHS)   SNAGCU   Level-3-260C-168 HR TMS32C6713BZDPA200 TMS32C6713BZDPA200
TMS320C6713B-300 应用技术支持与电子电路设计开发资源下载
  1. TMS320C6713B-300 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器数字信号处理器 (DSP) & ARM 微处理器选型与价格 . xls
  3. OMAP-L13x/AM1x Linux PSP Overview
  4. ARM Assembly Language Tools v4.7 User's Guide
  5. ARM Optimizing C/C++ Compiler v4.7 User's Guide
  6. Power Management for AM18xx/AM17xx Processors
  7. ARM Portfolio Technical Overview Brochure
  8. Software and Hardware Design Challenges due to Dynamic Raw NAND Market
  9. Programmable Real-Time Unit (PRU): Extending Functionality Of Existing SoCs
TMS320C6713B-300 工具与软件
培训内容 型号 软件/工具类型
Code Composer Studio (CCStudio) 集成开发环境 (IDE) v4.x CCSTUDIO Code Composer Studio(TM) IDE
XDS510 类仿真器 XDS510 仿真器/分析仪
DM6467T SD 子卡 TMDXSDV6467T 子卡
TMS320DM6467 引脚 Mux 实用程序 SPRC815 实用程序/插件
基于 C64x+ 器件的加密(OMAP35x、C645x、C647x、DM646x、DM644x, DM643x、DM674x、DM648) C64XPLUSCRYPTO 应用软件
演示 - DM6467 应用示例和演示代码 DEMOAPP-DM6467 应用软件
用于 TI DSP+ARM 处理器的 C6EZAccel 软件开发工具 C6ACCEL-DSPLIBS 应用软件
用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER TELECOMLIB 应用软件
AM/DM37x 评估模块 TMDSEVM3730 开发电路板/EVM
DM6467T 数字视频评估模块 TMDXEVM6467T 开发电路板/EVM
DM814x/AM387x 评估模块 TMDXEVM8148 开发电路板/EVM
DM816x/C6A816x/AM389x 评估模块 TMDXEVM8168 开发电路板/EVM
THS8135 评估模块 THS8135EVM 开发电路板/EVM
TVP5151 评估模块 TVP5151EVM 开发电路板/EVM
TVP5158 评估模块 TVP5158EVM 开发电路板/EVM
编解码器 - 针对 DM6467 器件进行了优化 DM6467CODECS 算法/ 解码器
编解码器 - 音频、视频、语音 - 适用于基于 C64x+ 的器件(OMAP35x、C645x、C647x、DM646、DM644x、DM643x) C64XPLUSCODECS 算法/ 解码器
Linux 数字视频软件开发套件 (DVSDK) v2x/v3x - 达芬奇数字媒体处理器 LINUXDVSDK-DV 软件开发套件 (SDK)