SN65LVDM050-Q1 汽车类双路 LVDS 发送器/接收器器

The SN65LVDM050, and SN65LVDM051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 500 Mbps (per TIA/EIA-644 definition). These circuits are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts, except that the output current of the drivers is doubled. This modification provides a minimum differential output voltage magnitude of 247 mV across a 50- load simulating two transmission lines in parallel. This allows having data buses with more than one driver or with two line termination resistors. The receivers detect a voltage difference of 50 mV with up to 1 V of ground potential difference between a transmitter and receiver.

SN65LVDM050-Q1
No. of Rx 2  
No. of Tx 2  
Input Signal LVDM, LVTTL  
Output Signal LVDM, LVTTL  
Signaling Rate(Mbps) 500  
Supply Voltage(s)(V) 3.3  
ICC(Max)(mA) 27  
Rx tpd(Typ)(ns) 3.7  
Tx tpd(Typ)(ns) 1.7  
Pin/Package 16SOIC  
Operating Temperature Range(�C) -40 to 125  
ESD HBM(kV) 12
SN65LVDM050-Q1 特性
SN65LVDM050-Q1 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDM050QDG4Q1 ACTIVE -40 to 125 1.80 | 1ku SOIC (D) | 16 40  
SN65LVDM050QDQ1 ACTIVE -40 to 125 1.80 | 1ku SOIC (D) | 16 40  
SN65LVDM050QDRG4Q1 ACTIVE -40 to 125 1.80 | 1ku SOIC (D) | 16 2500  
SN65LVDM050QDRQ1 ACTIVE -40 to 125 1.80 | 1ku SOIC (D) | 16 2500  
SN65LVDM050-Q1 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDM050QDG4Q1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050QDG4Q1 SN65LVDM050QDG4Q1
SN65LVDM050QDQ1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050QDQ1 SN65LVDM050QDQ1
SN65LVDM050QDRG4Q1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050QDRG4Q1 SN65LVDM050QDRG4Q1
SN65LVDM050QDRQ1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050QDRQ1 SN65LVDM050QDRQ1
SN65LVDM050-Q1 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDM050-Q1 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器M-LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)