SN65LVDS3487 具有 -2 至 4.4V 常见模式范围的四路 LVDS 接收器

The SN55LVDS31, SN65LVDS31, SN65LVDS3487, and SN65LVDS9638 are differential line drivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.

The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100

SN65LVDS3487
Input Signal LVDS  
Output Signal LVTTL  
No. of Rx 4  
Signaling Rate(Mbps) 400  
Supply Voltage(s)(V) 3.3  
ICC(Max)(mA) 35  
Rx tpd(Typ)(ns) 1.7  
Part-to-Part Skew(Max)(ps) 800  
Pin/Package 16SOIC  
Operating Temperature Range(°C) -40 to 85  
ESD HBM(kV) 8  
Approx. Price (US$) 1.20 | 1ku 
SN65LVDS3487 特性
SN65LVDS3487 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDS3487D ACTIVE -40 to 85 1.45 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS3487DG4 ACTIVE -40 to 85 1.45 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS3487DR ACTIVE -40 to 85 1.20 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS3487DRG4 ACTIVE -40 to 85 1.20 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS3487 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDS3487D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS3487D SN65LVDS3487D
SN65LVDS3487DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS3487DG4 SN65LVDS3487DG4
SN65LVDS3487DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS3487DR SN65LVDS3487DR
SN65LVDS3487DRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS3487DRG4 SN65LVDS3487DRG4
SN65LVDS3487 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDS3487 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)