SN65LVDT122 2x2 1.5Gbps LVDS 交叉点交换器

The SN65LVDS122 and SN65LVDT122 are crosspoint switches that use low voltage differential signaling (LVDS) to achieve signaling rates as high as 1.5 Gbps. They are pin-compatible speed upgrades to the SN65LVDS22 and SN65LVDM22. The internal signal paths maintain differential signaling for high speeds and low signal skews. These devices have a 0 V to 4 V common-mode input range that accepts LVDS, LVPECL, CML inputs. Two logic pins (S0 and S1) set the internal configuration between the differential inputs and outputs. This allows the flexibility to perform the following configurations: 2 x 2 crosspoint switch, 2:1 mux, 1:2 splitter or dual repeater/translator within a single device. Additionally, SN65LVDT122 incorporates a 110- termination resistor for those applications where board space is a premium.

SN65LVDT122
No. of Rx 2  
No. of Tx 2  
Signaling Rate(Mbps) 1500  
Supply Voltage(s)(V) 3.3  
ICC(Max)(mA) 100  
Pin/Package 16SOIC, 16TSSOP  
Operating Temperature Range(°C) -40 to 85  
Peak-to-Peak Jitter(Max)(ps) 65  
Output Signal LVDS  
Input Signal CML, LVDS, LVPECL  
Part-to-Part Skew(Max)(ps) 100  
Rx tpd(Typ)(ns) 0.65  
Tx tpd(Typ)(ns) 0.65  
ESD HBM(kV) 4  
Approx. Price (US$) 4.00 | 1ku
SN65LVDT122 特性
SN65LVDT122 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDT122D ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDT122DG4 ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDT122DR ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDT122DRG4 ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDT122PW ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDT122PWG4 ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDT122PWR ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDT122PWRG4 ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDT122 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDT122D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122D SN65LVDT122D
SN65LVDT122DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122DG4 SN65LVDT122DG4
SN65LVDT122DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122DR SN65LVDT122DR
SN65LVDT122DRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122DRG4 SN65LVDT122DRG4
SN65LVDT122PW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122PW SN65LVDT122PW
SN65LVDT122PWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122PWG4 SN65LVDT122PWG4
SN65LVDT122PWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122PWR SN65LVDT122PWR
SN65LVDT122PWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDT122PWRG4 SN65LVDT122PWRG4
SN65LVDT122 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDT122 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS/M-LVDS/ECL/CML选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)