SN75LVDS387 16 通道 LVDS 发送器

This family of four, eight, and sixteen differential line drivers implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the sixteen current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.

The intended application of this device and signaling technique is for point-to-point and multidrop baseband data transmission over controlled impedance media of approximately 100 . The transmission media can be printed-circuit board traces, backplanes, or cables

SN75LVDS387
Input Signal LVTTL  
Output Signal LVDS  
No. of Rx 16  
Signaling Rate(Mbps) 630  
Supply Voltage(s)(V) 3.3  
ICC(Max)(mA) 95  
Rx tpd(Typ)(ns) 1.7  
Part-to-Part Skew(Max)(ps) 1500  
Pin/Package 64TSSOP  
Operating Temperature Range(�C) 0 to 70  
ESD HBM(kV) 4  
Approx. Price (US$) 4.00 | 1ku
SN75LVDS387 特性
SN75LVDS387 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN75LVDS387DGG ACTIVE 0 to 70 4.80 | 1ku TSSOP (DGG) | 64 25 | TUBE  
SN75LVDS387DGGG4 ACTIVE 0 to 70 4.80 | 1ku TSSOP (DGG) | 64 25 | TUBE  
SN75LVDS387DGGR ACTIVE 0 to 70 4.00 | 1ku TSSOP (DGG) | 64 2000 | LARGE T&R  
SN75LVDS387DGGRG4 ACTIVE 0 to 70 4.00 | 1ku TSSOP (DGG) | 64 2000 | LARGE T&R  
SN75LVDS387 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN75LVDS387DGG Green (RoHS & no Sb/Br)  CU NIPDAU  Level-2-260C-1 YEAR SN75LVDS387DGG SN75LVDS387DGG
SN75LVDS387DGGG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-2-260C-1 YEAR SN75LVDS387DGGG4 SN75LVDS387DGGG4
SN75LVDS387DGGR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-2-260C-1 YEAR SN75LVDS387DGGR SN75LVDS387DGGR
SN75LVDS387DGGRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-2-260C-1 YEAR SN75LVDS387DGGRG4 SN75LVDS387DGGRG4
SN75LVDS387 应用技术支持与电子电路设计开发资源下载
  1. SN75LVDS387 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)