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TSU5511 具有阻抗检测微型 USB 开关的 SP3T 开关

The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART.

The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged.

	TSU5511
ESD HBM(kV)	2
Architecture	SP3T
ron(max)(ohms)	10
RON Flatness(Max)(Ohms)	0.5
Bandwidth(MHz)	830
ICC(uA)	15
IL OFF(Max)(nA)	25
Charge Injection(Max)(pC)	N/A
ON Time(Max)(ns)	120
OFF Time(Max)(ns)	75,000
Pin/Package	20DSBGA

TSU5511 特性

• Compatible Accessories
  • USB Data Cable
  • UART Cable
  • Charger (Dedicated Charger or Host/Hub Charger)
  • Stereo Headset With Mic
• Integrated LDOs for VREF and Mic Bias
• USB Path Supports USB 2.0 High Speed
• Audio Path Provides Negative Rail Support and Click/Pop Reduction
• Supports Factory Test Mode
• 1.8-V Compatible I2C Interface
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)
• ESD Performance DP/DM/ID/VBUS to GND
  • ±8-kV Contact Discharge (IEC 61000-4-2)
  • ±15-kV Air Gap Discharge (IEC 61000-4-2)
• APPLICATIONS
  • Cellular Telephones

TSU5511 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
TSU5511YZPR	ACTIVE	-40 to 85	0.90 | 1ku	DSBGA (YZP) | 20	3000 | LARGE T&R

TSU5511 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
TSU5511YZPR	Green (RoHS & no Sb/Br)	Call TI	Level-1-260C-UNLIM	TSU5511YZPR	TSU5511YZPR

TSU5511 应用技术支持与电子电路设计开发资源下载

1. TSU5511 数据资料 dataSheet 下载.PDF
2. TI 德州仪器USB选型与价格 . xls
3. 所选封装材料的热学和电学性质 (PDF 645 KB)
4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
5. 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
6. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
7. 接口选择指南 (Rev. D) (PDF 2994 KB)
8. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
9. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
11. Analog Signal Chain Guide (8.62 MB)
12. Industrial Interface IC Solutions (101 KB)