SN65LVDM050 双路 LVDS 发送器/接收器

The SN65LVDM179, SN65LVDM180, SN65LVDM050, and SN65LVDM051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve high signaling rates. These circuits are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts, except that the output current of the drivers is doubled. This modification provides a minimum differential output voltage magnitude of 247 mV across a 50- load simulating two transmission lines in parallel. This allows having data buses with more than one driver or with two line termination resistors. The receivers detect a voltage difference of 50 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of these devices and signaling techniques is point-to-point half duplex, baseband data transmission over a controlled impedance media of approximately 100 characteristic impedance

SN65LVDM050 SN65LVDM051 SN65LVDS049 SN65LVDS050 SN65LVDS051 SN65LVDS1050 SN65LVDS32B SN65LVDS33 SN65LVDT32B SN65LVDT33
No. of Rx 2   2   2   2   2   2   4   4   4   4  
No. of Tx 2   2   2   2   2   2          
Input Signal LVDM, LVTTL   LVDM, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS   CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL   LVDS   LVDS, LVECL, LVPECL, PECL  
Output Signal LVDM, LVTTL   LVDM, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVTTL   LVTTL   LVTTL   LVTTL  
Signaling Rate(Mbps) 500TX/100RX   500TX/100RX   400   400TX/100RX   400TX/100RX   400   400   400   400   400  
Supply Voltage(s)(V) 3.3   3.3   3.3   3.3   3.3   3.3   3.3   3.3   3.3   3.3  
ICC(Max)(mA) 27   27   35   20   20   20   23   23   23   23  
Part-to-Part Skew(Max)(ps) 1000   1000   1000         1000   1000   1000   1000  
Rx tpd(Typ)(ns) 3.7   3.7   1.9   3.7   3.7   3.7   4   4   4   4  
Tx tpd(Typ)(ns) 1.7   1.7   1.3   1.7   1.7   1.7          
Pin/Package 16SOIC, 16TSSOP   16SOIC, 16TSSOP   16TSSOP   16SOIC, 16TSSOP   16SOIC, 16TSSOP   16TSSOP   16SOIC   16SOIC, 16TSSOP   16SOIC   16SOIC, 16TSSOP  
Operating Temperature Range(�C) -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85  
ESD HBM(kV) 12   12   10   12   12   12   15   15   15   15 
SN65LVDM050 特性
SN65LVDM050 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDM050D ACTIVE -40 to 85 1.80 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDM050DG4 ACTIVE -40 to 85 1.80 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDM050DR ACTIVE -40 to 85 1.50 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDM050DRG4 ACTIVE -40 to 85 1.50 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDM050PW ACTIVE -40 to 85 1.80 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDM050PWG4 ACTIVE -40 to 85 1.80 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDM050PWR ACTIVE -40 to 85 1.50 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDM050PWRG4 ACTIVE -40 to 85 1.50 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDM050 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDM050D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050D SN65LVDM050D
SN65LVDM050DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050DG4 SN65LVDM050DG4
SN65LVDM050DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050DR SN65LVDM050DR
SN65LVDM050DRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050DRG4 SN65LVDM050DRG4
SN65LVDM050PW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050PW SN65LVDM050PW
SN65LVDM050PWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050PWG4 SN65LVDM050PWG4
SN65LVDM050PWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050PWR SN65LVDM050PWR
SN65LVDM050PWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDM050PWRG4 SN65LVDM050PWRG4
SN65LVDM050 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDM050 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器M-LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)