SN65LVDS051 双路 LVDS 发送器/接收器

The SN65LVDS179, SN65LVDS180, SN65LVDS050, and SN65LVDS051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps (see the Application Information section). The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100- load and receipt of 50-mV signals with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100- characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables

SN65LVDM050 SN65LVDM051 SN65LVDS049 SN65LVDS050 SN65LVDS051 SN65LVDS1050 SN65LVDS32B SN65LVDS33 SN65LVDT32B SN65LVDT33
Input Signal LVDM, LVTTL   LVDM, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS   CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL   LVDS   LVDS, LVECL, LVPECL, PECL  
Output Signal LVDM, LVTTL   LVDM, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVDS, LVTTL   LVTTL   LVTTL   LVTTL   LVTTL  
No. of Rx 2   2   2   2   2   2   4   4   4   4  
No. of Tx 2   2   2   2   2   2          
Signaling Rate(Mbps) 500TX/100RX   500TX/100RX   400   400TX/100RX   400TX/100RX   400   400   400   400   400  
Supply Voltage(s)(V) 3.3   3.3   3.3   3.3   3.3   3.3   3.3   3.3   3.3   3.3  
ICC(Max)(mA) 27   27   35   20   20   20   23   23   23   23  
Rx tpd(Typ)(ns) 3.7   3.7   1.9   3.7   3.7   3.7   4   4   4   4  
Tx tpd(Typ)(ns) 1.7   1.7   1.3   1.7   1.7   1.7          
Part-to-Part Skew(Max)(ps) 1000   1000   1000         1000   1000   1000   1000  
Pin/Package 16SOIC, 16TSSOP   16SOIC, 16TSSOP   16TSSOP   16SOIC, 16TSSOP   16SOIC, 16TSSOP   16TSSOP   16SOIC   16SOIC, 16TSSOP   16SOIC   16SOIC, 16TSSOP  
Operating Temperature Range(°C) -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85   -40 to 85  
ESD HBM(kV) 12   12   10   12   12   12   15   15   15   15  
Approx. Price (US$) 1.50 | 1ku   1.50 | 1ku   0.95 | 1ku   1.50 | 1ku   1.50 | 1ku   1.65 | 1ku   2.70 | 1ku   1.20 | 1ku   3.40 | 1ku   1.50 | 1ku
SN65LVDS051 特性
SN65LVDS051 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDS051D ACTIVE -40 to 85 1.80 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS051DG4 ACTIVE -40 to 85 1.80 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS051DR ACTIVE -40 to 85 1.50 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS051DRG4 ACTIVE -40 to 85 1.50 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS051PW ACTIVE   1.80 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS051PWG4 ACTIVE   1.80 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS051PWR ACTIVE   1.50 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS051PWRG4 ACTIVE   1.50 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS051 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDS051D Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051D SN65LVDS051D
SN65LVDS051DG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051DG4 SN65LVDS051DG4
SN65LVDS051DR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051DR SN65LVDS051DR
SN65LVDS051DRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051DRG4 SN65LVDS051DRG4
SN65LVDS051PW Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051PW SN65LVDS051PW
SN65LVDS051PWG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051PWG4 SN65LVDS051PWG4
SN65LVDS051PWR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051PWR SN65LVDS051PWR
SN65LVDS051PWRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN65LVDS051PWRG4 SN65LVDS051PWRG4
SN65LVDS051 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDS051 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)